Basic Information | ||
Supported CPU | AMD Ryzen 5000 Series/ 3rd Generation AMD Ryzen processors/ 3rd Generation AMD Ryzen with Radeon Graphics processors | |
Chipset | AMD B550 | |
BIOS | 1 x 256 Mbit flash Use of licensed AMI UEFI BIOS PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0 | |
Form Factor | ATX Form Factor; 30.5cm x 24.4cm | |
Expansion Slots | ||
PCI | 1 x PCI Express x16 slot (PCIEX16), integrated in the CPU: 3rd Generation AMD Ryzen processors support PCIe 4.0 x16 mode 3rd Generation AMD Ryzen with Radeon Graphics processors support PCIe 3.0 x16 mode 1 x PCI Express x16 slot (PCIEX8), integrated in the CPU: 3rd Generation AMD Ryzen processors support PCIe 4.0 x8 mode 3rd Generation AMD Ryzen with Radeon Graphics processors support PCIe 3.0 x8 mode 1 x PCI Express x16 slot (PCIEX4), integrated in the Chipset: Supporting PCIe 3.0 x4 mode | |
M.2 Socket | 1 x M.2 connector (M2A_CPU), integrated in the CPU, supporting Socket 3, M key, type 2242/ 2260/ 2280/ 22110 SSDs: 3rd Generation AMD Ryzen processors support SATA and PCIe 4.0 x4/x2 SSDs 3rd Generation AMD Ryzen with Radeon Graphics processors support SATA and PCIe 3.0 x4/x2 SSDs 1 x M.2 connector (M2B_SB), integrated in the Chipset, supporting Socket 3, M key, type 2242/ 2260/ 2280/ 22110 SSDs: Supporting SATA and PCIe 3.0 x4/x2 SSDs | |
Memory | ||
Type | DDR4 | |
Slots | 4 x DIMM slots | |
Supported Memory | AMD Ryzen 5000 series processors: Support for DDR4 5100(O.C.) / 5000(O.C.) / 4866(O.C.) / 4600(O.C.) / 4400(O.C.) / 4000(O.C.) / 3600(O.C.) / 3333(O.C.) / 3200/ 2933/ 2667/ 2400/ 2133 MHz memory modules 3rd Gen AMD Ryzen Processors: Support for DDR4 5200(O.C.) / 5000(O.C.) / 4866(O.C.) / 4600(O.C.) / 4400(O.C.) / 4000(O.C.) / 3600(O.C.) / 3333(O.C.) / 3200/ 2933/ 2667/ 2400/ 2133 MHz memory modules 3rd Gen AMD Ryzen with Radeon Graphics processors: Support for DDR4 5400(O.C.) / 5200(O.C.) / 5000(O.C.) / 4866(O.C.) / 4600(O.C.) / 4400(O.C.) / 4000(O.C.) / 3600(O.C.) / 3333(O.C.) / 3200/ 2933/ 2667/ 2400/ 2133 MHz memory modules Dual channel memory architecture Support for ECC Un-buffered DIMM 1Rx8/ 2Rx8 memory modules Support for non-ECC Un-buffered DIMM 1Rx8/ 2Rx8/ 1Rx16 memory modules Support for Extreme Memory Profile (XMP) memory modules | |
Maximum Memory | Up to 128GB (32 GB single DIMM capacity) | |
Graphics | ||
Graphics | Integrated in the 3rd Generation AMD Ryzen with Radeon Graphics processors + Intel Thunderbolt 3 Controller: 2 x Intel Thunderbolt 3 connectors (USB Type-C ports), supporting DisplayPort and Thunderbolt video outputs and a maximum resolution of 5120 x 2880 @60 Hz with 24 bpp * Because of the limited I/O resources of the PC architecture, the number of Thunderbolt devices that can be used is dependent on the number of the PCI Express devices being installed. (Refer to Chapter 1-6, "Back Panel Connectors," for more information.) * Support for DisplayPort 1.4 version, HDCP 2.3, and HDR. Integrated in the 3rd Generation AMD Ryzen with Radeon Graphics processors: 1 x HDMI port, supporting a maximum resolution of 4096 x 2160 @60 Hz * Support for HDMI 2.1 version, HDCP 2.3, and HDR. Support for AMD Quad-GPU CrossFire and 2-Way AMD CrossFire technologies | |
Max Shared Memory | 16 GB | |
Connector & Ports | ||
HDMI | 1 x HDMI port, supporting a maximum resolution of 4096 x 2160 @60 Hz | |
USB (s) | 2 x Intel Thunderbolt 3 connectors (USB Type-C ports), supporting DisplayPort and Thunderbolt video outputs and a maximum resolution of 5120 x 2880 @60 Hz with 24 bpp Integrated in the CPU: 3 x USB 3.2 Gen 1 ports on the back panel 1 x USB 3.2 Gen 2 Type-A port (red) on the back panel Chipset + Intel Thunderbolt 3 Controller: 2 x USB Type-C ports on the back panel, with USB 3.2 Gen 2 support Chipset: 1 x USB Type-C port with USB 3.2 Gen 1 support, available through the internal USB header 1 x USB 3.2 Gen 2 Type-A port (red) on the back panel 2 x USB 3.2 Gen 1 ports available through the internal USB header 1 x USB 2.0/1.1 port on the back panel Chipset + 2 USB 2.0 Hubs: 5 x USB 2.0/1.1 ports (1 port on the back panel, 4 ports available through the internal USB headers) | |
LAN Port (s) | Intel 2.5GbE LAN chip (2.5 Gbit/ 1000 Mbit/ 100 Mbit) (LAN1) Realtek 2.5GbE LAN chip (2.5 Gbit/ 1000 Mbit/ 100 Mbit) (LAN2) | |
Wireless Communication module | Intel Wi-Fi 6 AX200 WIFI a, b, g, n, ac with wave 2 features, ax, supporting 2.4/ 5 GHz Dual-Band BLUETOOTH 5 Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate | |
Supported Storage | 1 x M.2 connector (M2A_CPU), integrated in the CPU, supporting Socket 3, M key, type 2242/ 2260/ 2280/ 22110 SSDs: 3rd Generation AMD Ryzen processors support SATA and PCIe 4.0 x4/x2 SSDs 3rd Generation AMD Ryzen with Radeon Graphics processors support SATA and PCIe 3.0 x4/x2 SSDs 1 x M.2 connector (M2B_SB), integrated in the Chipset, supporting Socket 3, M key, type 2242/ 2260/ 2280/ 22110 SSDs: Supporting SATA and PCIe 3.0 x4/x2 SSDs 4 x SATA 6Gb/s connectors, integrated in the Chipset: Support for RAID 0, RAID 1, and RAID 10 | |
Audio | Realtek ALC1220-VB codec Support for DTS:X Ultra High Definition Audio 2/ 4/ 5.1/ 7.1-channel Support for S/PDIF Out | |
Internal I/O Ports | 1 x 24-pin ATX main power connector 1 x 8-pin ATX 12V power connector 1 x CPU fan header 1 x water cooling CPU fan header 4 x system fan headers 2 x system fan/water cooling pump headers 2 x addressable LED strip headers 2 x RGB LED strip headers 1 x CPU cooler LED strip/RGB LED strip header 2 x M.2 Socket 3 connectors 4 x SATA 6Gb/s connectors 1 x SATA DOM power connector 1 x front panel header 1 x front panel audio header 1 x USB Type-C™ port, with USB 3.2 Gen 1 support 1 x USB 3.2 Gen 1 header 2 x USB 2.0/1.1 headers 1 x serial port header 1 x Clear CMOS jumper 2 x temperature sensor headers 1 x Q-Flash Plus button | |
TPM (Trusted Platform Module ) | 1 x Trusted Platform Module (TPM) header (2x6 pin, for the GC-TPM2.0_S module only) | |
Others | ||
Special Features | Support for APP Center @BIOS EasyTune Fast Boot Game Boost ON/OFF Charge RGB Fusion Smart Backup System Information Viewer Support for Q-Flash Plus Support for Q-Flash Support for Xpress Install | |
Warranty Information | ||
Manufacturing Warranty | 03 Years |
GIGABYTE VISION Series motherboards are built for creator pc. It featured with reliable performance, impressive connectivity, expandable on graphics, and ultra-fast storage for creators to deal with heavy design workloads such as video editing and 3D rendering. It's the perfect fit for DIY creators to build their own ideal machine.
Error Correction Code (ECC) memory corrects errors in your data as it passes in and out of memory to ensure reliability for critical applications. Multi-graphics configurations offer better graphics performance for applications which demand the highest frame rates without compromising on resolution. NVIDIA QUADRO 3D Workstation Professional Graphics Solutions are designed and built specifically for artists, designers, and engineers, NVIDIA Quadro GPUs power more than 100 professional applications across a broad range of industries. Professionals trust them to enable their best work using applications such as Adobe Creative Cloud, Avid Media Composer, Autodesk Suites, Dassault Systemes, CATIA and SOLIDWORKS, Siemens NX, PTC Creo, and many more.
GIGABYTE Thunderboltâ„¢ motherboards allow users to daisy chain up to 12 devices simultaneously via an incredible bi-directional 40Gbps data pipeline that includes both PCIe and DisplayPort traffic. It redefines desktop PC connectivity to make it far easier to connect multiple high-speed storage devices and HD displays to your PC than ever before.
With both LAN ports designed, you'll benefit from increased bandwidth for speed, automated load balancing for smoother data flow, and instant failover if anything goes wrong. Adoption of dual 2.5G Ethernet provides an immediate boost to overall network performance, and greatly improves the bandwidth required at large file transfers, video editing, and professional workloads. Intel Wireless solution supports 802.11ax, enables gigabit wireless performance, provides smooth video streaming, better gaming experience, fewer dropped connections, and speeds up to 2.4Gbps. Wi-Fi 6 is designed to improve speed, increase efficiency, and reduce congestion in heavy bandwidth usage scenarios. The back panel of B550 VISION D-P features with USB 3.2 Gen2 ports design, which is twice the bandwidth compared to its previous. Be enjoying ultimate connection flexibility and brilliant transfer speeds of up to 10Gbps. Front-panel header with USB 3.2 Gen1 connectivity is ready for compatible devices.
Effective cooling solution is essential for a heavy design workload to get away with slow down, crashes, and unexpected shutdown. Unconventional Heatsinks is designed for better thermal dissipation but also aesthetically appealing to creators. Iconic curved heatsink covers the hottest VRM area to ensure efficient power delivery for stable performance. Creators transfer larger file with un-throttled storage performance by efficient M.2 heatsinks. Eight hybrid fan headers and numerous temperature sensors are planted on the motherboard to monitor in real time and configure fan mode to fit different workloads via Smart Fan 5. Creators are allowed to set the trigger point to activate the fan and its corresponding speed. The fan completely stops when performing light tasks to avoid noise.
For most prosumers and content creators, high bandwidth storage and high performance graphics card or accelerator cards are critical for their projects. This is especially true for 3D rendering and creating high resolution textures. To support most cutting edge devices, this motherboard uses the groundbreaking PCIe 4.0 hardware design. From PCB, several new IC to device connectors, everything that the PCIe 4.0 signal goes is a completely new generation, to make sure your content creation PC is future proof. Content creators workflows constantly involve huge files, such as images, videos, and 3D models. Time for editing, saving, and transferring those huge files can be substantially reduced with the new generation PCIe 4.0 SSD.
M.2 Drives keep the load times away. Breaking the barriers of SATA limitations. M.2 PCIe SSD gives you X7 faster data transferring experience compared to 2.5" SATA solid state drives. M.2, the latest storage technology. GIGABYTE M.2 solution offers considerably faster storage performance and provides an ideal storage with RAID modes. To feature PCIe 4.0*/3.0 x4 and PCIe 3.0 x4 M.2 connectors for offering the best compatibility in terms of NVMe storage for creators who demand high capacity and seek the best performance. With durability in mind, GIGABYTE provides a thermal solution for M.2 drives. This unique M.2 Thermal Guard prevents throttling and bottlenecks from M.2 devices as it helps to reduce and dissipate heat before it becomes an issue.
DTS:X Ultra is capable of delivering consumers a truly premium entertainment experience by completely surrounding the listener and expanding the sound stage to create a more immersive environment. Supports channel-based, scene based, and object-based audio. Also, it takes movies, music, and interactive gaming experiences to an exciting new level.
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03 Years